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TSMC (TWSE: 2330, NYSE: TSM) is showcasing the latest innovations in its logic, specialty, and 3D IC technologies today at its 2022 North America Technology Symposium, featuring the optimized next-generation N2 process by nanoscale sheet transistors (nanosheet) and by the unique FinFlex technology™ for N3 and N3E processes.

Returning to its face-to-face format after being held online for the past two years, the North American Symposium in Santa Clara, California marks the start of a series of Technology Symposia around the world in the coming months. These Symposiums also have an Innovation zone highlighting the achievements of TSMC’s client startups.

“We live in an evolving digital world in which the demand for computing power and energy efficiency is growing at an unprecedented rate, creating unprecedented opportunities and challenges for the semiconductor industry,” said CC Wei, CEO of TSMC. “The innovations we will be showcasing at our Technology Symposiums exemplify TSMC’s leadership and commitment to supporting its customers during this exciting time of transformation and growth.”

Key technologies presented during the Symposium:

TSMC FinFlex™ for N3 and N3E processes – TSMC’s industry-leading N3 technology, expected to enter mass production in 2022, will feature groundbreaking TSMC FinFlex architectural innovation™ to provide unparalleled flexibility to designers. TSMC FinFlex innovation™ offers standard cell choices with a 3-2 fin configuration for exceptional performance, a 2-1 fin configuration for optimum power efficiency and transistor density, and a 2-2 fin configuration providing a balance of efficiency and performance. With TSMC FinFlex architecture™, customers can create SoCs with high precision that meet their building block needs to deploy the best configuration between performance, power and area, all integrated on the same chip. For more information on FinFlex, visit N3.TSMC.COM.

N2 Technology – Another notable advancement over N3 is TSMC’s N2 technology, with a 10-15% increase in speed at the same power, or a 25-30% energy reduction at the same speed, paving the way for the era of efficient performance. N2 will feature the nanosheet transistor architecture to provide improved full-node performance and power efficiency to enable next-generation innovations by TSMC customers. The N2 technology platform includes a high-performance variant in addition to the basic mobile computing version, as well as comprehensive chiplet integration solutions. Production of N2 is expected to begin in 2025.

Expansion of the ultra-efficient platform – Building on the success of the N12e technology announced at the 2020 Technology Symposium, TSMC is now developing the N6e, which marks the technological evolution of processes to deliver the computing power and energy efficiency required by AI devices. and IoT at the edge. N6e will be based on TSMC’s 7nm process and is expected to have three times the logic density of N12e. It will be part of TSMC’s Ultra Efficient Platform, a comprehensive portfolio of logic, RF, analog, and embedded non-volatile memory and power management IC solutions for edge AI and IoT applications. .

3D Chip Stacking Solutions TSMC 3DFabric™ – TSMC Introduces Two Breakthrough Customer Applications of the TSMC-SoIC Solution™ chip stacking:

  1. The world’s first SoIC-based CPU employing Chip-on-Wafer (CoW) technology to stack SRAM as Level 3 cache

  2. A revolutionary intelligence processing unit stacked on a deep-trench capacitor mold using Wafer-on-Wafer (WoW) technology.

With N7 chips already in production for both CoW and WoW technologies, support for N5 technology is planned for 2023. To meet customer demand for SoIC services and other system integration services TSMC 3DFabric™the world’s first fully automated 3DFabric site is expected to begin production in the second half of 2022.

About TSMC

TSMC pioneered the single-craft foundry model when it was founded in 1987, and has remained the world leader in dedicated semiconductor foundries ever since. The company supports a thriving ecosystem of global customers and partners through its unmatched process technologies and portfolio of design solutions to drive innovation in the global semiconductor industry. With operations in Asia, Europe and North America, TSMC is a globally engaged corporate citizen.

TSMC deployed 291 distinct process technologies and manufactured 12,302 products for 535 customers in 2021 by providing the widest range of advanced and specialized packaging technology services. TSMC is the first foundry to offer 5-nanometer precision production capabilities, the world’s most advanced semiconductor process technology. The company is based in Hsinchu, Taiwan. For more information, please visit https://www.tsmc.com.

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